Precautions during the assembly of flexible PCB

1.Solder paste must be refrigerated.

For the solder paste that is not used immediately, it must be placed in the refrigerator, and the temperature is maintained at 5℃-0℃, not lower than 0℃.

2.We must replace the assembly machine which is easy to wear out in time.

In the assembly process of flexible printed circuit, the aging of the assembly machine equipment and the damage of the feeder or nozzle will cause the occurrence of high throwing material, which is easy to lead to the distortion of the assembly machine, thereby increasing the production cost and reducing the production efficiency. If we cannot replace the equipment, we need to carefully check whether the nozzle is blocked, or damaged, and whether the feeder is in good condition.

3.Test the temperature of reflow furnace.

Whether the reflow process parameters are reasonable or not is directly related to the welding quality of flexible PCB. It is generally necessary to conduct two furnace temperature tests, at least once, to continuously improve the temperature distribution, so that it matches the temperature distribution of the welding product. In order to increase productivity and save costs, don't miss this link.

4.Control the workshop environment.

SMT processing has certain requirements for environment, humidity and temperature. In order to ensure the quality of installation, it is necessary to ensure that the machining shop meets the requirements of the working environment. The above is SMT processing precautions, I hope to help you.

Flexible PCB assembly process should pay attention to the problem

1.Storage

For the SMT adhesive for the fingerprint module of the soft board, strictly follow the instructions. Under normal circumstances, it is necessary to store the SMT glue of the fingerprint module soft board in the cold storage environment of 5 ° C ~ 10 ° C. Do not use or store the glue used to process the SMT patch of the fingerprint module soft board near the fire source. The remaining patch glue in the container must be stored in the container and stored at a low temperature.

2.Temperature going back

The SMT adhesive must be restored to temperature before being used in SMT processing because it is kept at a low temperature. Under normal circumstances, the temperature recovery time should not be less than 3 hours at room temperature. It is important to note that the inability to use heating methods to restore the temperature during SMT may cause performance problems with the adhesive. 

3.Application

In SMT processing, it is necessary to stir SMT glue before use, and it can be used for up to 24h after mixing. If the SMT adhesive is not used up, it should be stored in a special container and do not mix with the new adhesive.

4.Syringe

The SMT adhesive should be loaded into the syringe in a completely bubble-free state.

5.Environment temperature

The operating place should be controlled under constant temperature, and the greater temperature change has a certain impact on the quality of the bonding coating.

6.Coating

Last but not least, the adhesive is applied to the specified area of the flexible printed circuit board. The adhesive coating technology can be distributed dot coating technology, needle transfer technology and offset printing technology.

When the application method of the adhesive is different, its performance requirements are also different. Adhesives suitable for dispensing dot coating may not be suitable for needle transfer technology coating, and vice versa. Therefore, according to the coating method, choose the correct adhesive type.

Why Choose US?

Xenatronics is one of the best PCB assembly manufacturers in China. We have always supplied printed circuit board components at high quality and reasonable prices. Flexible to meet any requirements so that we have been praised by customers.

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